This complementary mix of solutions must be well integrated in order to address the application in the most cost-effective manner. In addition, isolated single-chip current sensors in bridgeless Power Factor Correction (PFC) and DC-DC converters are also improving efficiency and thermal management. For example, fast-switching wide-bandgap Silicon Carbide (SiC) or Gallium Nitride (GaN) semiconductors are currently revolutionizing the industry. This drives power engineers and architects to extend existing power technology boundaries to achieve higher system efficiencies, faster response times, and more robust and reliable solutions.Īdvanced topology innovations and new power semiconductor advances have also provided solutions to address power electronics efficiency. Artificial Intelligence, Cloud-based IoT, next-gen RF technologies, self-driving EVs, and other advanced solutions have significantly increased the overall global electrical power demand.
Regardless of the core technology, electronics need electricity to work, and nothing happens unless you have energy.
This demand for power is going up exponentially with the growing number of devices being turned on every day, and efficiency is the only way to mitigate that massive demand. Providing advanced functionality needs lots of power, and it is behind almost everything in our modern society. Creating efficient power solutions is a critical aspect of every design today, no matter the size and power level. Not only must every player in the game operate as efficiently as possible, they must do so. When it comes to advanced systems like robotics, wearables, green energy, and the smart grid, the amount of power being generated, transferred, and converted at multiple stages is substantial. This enhances the functionality, reliability, durability, and operational lifetime of the product itself. More efficient systems have reduced thermal issues, improved operating costs, and other cascading benefits from more optimized functionality.įor example, not only does reducing the thermal load on the system save money and reduce the need for cooling, but the cascading benefits include reduced thermal shock and therefore longer MTBF, It also relaxes the packaging and insulation requirements, which increases footprint and form factor flexibility, reduced bill of materials, and on, for every subsystem.
To achieve substantial benefits, every application solution needs to run at the highest efficiency it is capable of achieving. Energy efficiency has become a critical capability in today’s world, due to pressures from every sector of the market. There is a lot of attention being paid to advanced power systems. By Bill Luo (Luo Zhizheng), Sr FAE, ACEINNA Transducer Systems and Jason Zhang (Zhang Liang), AE Director, Shenzhen Advantaged Power Limited
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